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PRO 1600 is a forced air / nitrogen convection reflow oven with a small footprint measuring only 31" x 31" (80cm x 80cm). It has been designed for reflow soldering of even the most challenging applications including metal core, high thermal mass, RF / microwave housings, wafer boards, and ceramic assemblies. PRO 1600 is very user friendly in terms of profile creation and modification. Sealed heating chamber enables ramp up rates of up to 4° Celsius/second from ambient and programming of up to 10 profile zones. It offers a unique On-The-Fly settings adjustment capability that allows creating and optimizing profiles all in a single pass. Where other batch and conveyor ovens fail to meet the desired profile curve, PRO 1600 excels.
Precise software control delivers unsurpassed temperature uniformity. Maintaining a low delta T across all of the components on the assembly ensures that they are not overheated or thermally stressed. Even for prototypes, this often means avoiding to spend hours of testing and debugging failed boards. With the optional External Thermocouple Control (ETC), profiles may be processed based on temperature readings of the assembly, not the air temperature around it. An optional Video Recording and Observation Module allows taking high magnification images and recording video during a soldering cycle. Increased productivity, superior performance and ease of operation make the PRO 1600 a versatile system ideal for small to medium run production, prototyping, NPI, testing or curing.
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Why solder in a Nitrogen reflow oven?
Most PCBs are reflowed in an air atmosphere with great results. However, for mission critical or high reliability applications (i.e. aerospace, military, telecommunications) reflow soldering in a Nitrogen gas atmosphere with low levels of Oxygen is common and is a preferred setup. There are two main reasons for this.
First, Nitrogen is an inert gas that is purged in the reflow chamber to displace Oxygen. Low levels of Oxygen (below 500 PPM) mean there is less oxidation at the solder joints when the alloy is in a molten state. This yields metallurgically stronger solder joints with less voiding and in turn higher quality product that is able to withstand longer thermal cycles and pass the required reliability testing. For most applications, Oxygen PPM level below 1,000 may be required however, some specify O2 under 10 PPM which is essentially an Oxygen free environment.
Second main reason for using Nitrogen during reflow soldering is that it allows for a wider process window than traditional air reflow. PCB assemblies that are thermally heavy due to their mass or materials may take too long to get to reflow temperatures. In an air reflow oven, this will cause flux burn off and by the time solder paste reaches melting temperature there may not be enough flux left to remove the oxide film from the board pads to allow for proper wetting of solder. If reflowed in a Nitrogen atmosphere, even if most of the flux is burned off, low concentration of oxygen means there is very little oxides at the pads so oxidation will not interfere with quality of the solder joint formation. This means a PCB may be reflowed with a profile that takes considerably more time than is recommended by the solder paste manufacturer and still have high quality solder joints.
Unlike a long tunnel or conveyor type SMT reflow oven, PRO 1600 does not need to be pre-heated before it is ready to process PCBs. An operator would simply turn on the power, load the control software and the system is ready for reflow soldering with the chamber at ambient temperature. This is especially helpful in non-production type environments like prototype labs or for small lot runs typically saving 30 minutes or more by eliminating preheating.
When PRO 1600 is turned on, the cover automatically opens while the loading tray slides out slowly for easy access to place down circuit boards. Once PCBs are loaded (either single or double sided), the operator would select an appropriate reflow oven profile from the software screen. A reflow oven profile is a pre-programmed set of parameters like ramp up rate, temperature, time at set temperature, cooling method, etc., that is specific to the PCBs being soldered. The software includes a library of different profiles tailored to the solder type used in the process as well as general size and mass of the circuit board. An operator can create custom profiles for their unique boards or simply optimize the existing profiles.
As the Start icon is activated, the loading tray automatically slides into the reflow chamber at an adjustable and controlled speed. A reflow profile is then processed per the programmed settings. PRO 1600’s control software constantly monitors actual ramp up rates and temperature inside an oven to the programmed values for accuracy. Once the reflow cycle is complete, the cover will open slowly and tray automatically exits from a heating chamber. PRO 1600 is now in a standby mode, ready for a new cycle run.
The following parameters may be programmed for each profile:
Profiles are developed, stored, and recalled within PRO 1600’s software package. It controls the reflow cycle, automation of process sequences, and automatic execution of safety checks before and during every profile run.
There are two standard configurations of the PRO 1600 series. They both share the same design and principle of operation. Below is a comparison matrix outlining features of each model. Additionally, various modifications may be made to satisfy specific application requirements. They include higher temperature rating, process video recording, and fixture customization.
PRO 1600-S | PRO 1600-EXN | |
---|---|---|
Full Convection |
X
|
X
|
Lead Free Compatible |
X
|
X
|
10 Heating Zones |
X
|
X
|
2 Cooling Zones |
X
|
X
|
Footprint of 31" x 31" |
X
|
X
|
Computer Control |
X
|
X
|
Software Package |
X
|
X
|
Library with 50 profiles |
X
|
X
|
Exhaust / Fume Cleaning |
N/A
|
X
|
Nitorgen Reflow Capable |
N/A
|
X
|
Notebook PC |
N/A
|
X
|
ETC-PRO |
O
|
O
|
MTDA-PRO |
O
|
O
|
DSBF-PRO |
O
|
O
|
ECF-PRO |
O
|
O
|
LCS-PRO |
O
|
O
|
X - Included O - Optional N/A - Not Available |
PRO 1600-S | PRO 1600-EXN | |
---|---|---|
Temperature: | up to 375° Celsius | up to 375° Celsius |
Reflow Area: | 20" x 20" / 508mm x 508mm | 20" x 20" / 508mm x 508mm |
Topside Clearance: | 4" / 101mm | 4" / 101mm |
Programmable Heating Zones: | 10 | 10 |
Cooling Zones: | 2 | 2 |
Heating Type: | Full Forced Air Convection | Full Forced Air / Nitrogen Convection |
Interior: | Stainless Steel | Stainless Steel |
Air Requirements: | 80 - 120 PSI @ 0.3 CFM | 80 - 120 PSI @ 0.3 CFM |
Power Requirements: | 120/208 VAC, 3 Phase, 50 Amp, 50/60 Hz | 120/208 VAC, 3 Phase, 50 Amp, 50/60 Hz |
Optional | 200-240 VAC, 3 Phase, 50 Amp, 50/60 Hz | 200-240 VAC, 3 Phase, 50 Amp, 50/60 Hz |
Optional | 380-400 VAC, 3 Phase, 50 Amp, 50/60 Hz | 380-400 VAC, 3 Phase, 50 Amp, 50/60 Hz |
Peak Power Consumption: | 16 Kw (during ramp up stages of a profile) | 16 Kw (during ramp up stages of a profile) |
Operating Consumption: | 9 Kw (during reflow) | 9 Kw (during reflow) |
Warranty: | Five (5) years | Five (5) years |
Agency Approvals: | CE | CE |
Weight: | 176 lbs / 79 Kg | 190 lbs / 86 Kg |
Dimensions: | 31"L x 31"W x 50"H / 787mm x 787mm x 1270mm | 31"L x 31"W x 50"H / 787mm x 787mm x 1270mm |