SMT Reflow Oven for PCB Soldering
With 40 years of experience in developing and manufacturing circuit board soldering equipment, ATCO is now offering the second generation PRO 1600 SMT Reflow Oven. As a leading batch soldering machine and solder reflow manufacturer, we are on a mission to provide innovative solutions for the ever-evolving demands within the printed circuit board industry. Dedicated to quality engineering and superior service, our soldering machines and reflow ovens achieve repeatable, high quality results customers can count on.
Our engineers developed the PRO 1600 SMT Reflow Oven to solve a variety of common issues associated with inconsistent reflow soldering in batch and benchtop tunnel ovens. While many reflow ovens on the market are adequate for simple soldering projects, we designed the PRO 1600 to be a high end oven with capabilities matching large scale production ovens. This includes precise temperature monitoring at the circuit assembly and if necessary ability to purge Nitrogen within the reflow chamber for Oxygen concentration down to 10 PPM. The focus is to achieve guaranteed high quality product with strong and reliable solder joints. Our reflow ovens aim to bridge the gap between low end ovens and large scale production machines; with consistent heating profiles, a simple user interface, process automation, and detailed data for complete transparency and consistency throughout the SMT (Surface Mount Technology) reflow process.
Our team wanted to create an SMT oven catering to the end user with a simplified setup and ease of operation. Thanks to our advanced software integration, with powerful heating capability, our SMT reflow oven achieves the user friendly end goal. With on-the-fly profile adjustment and ultra-accurate temperature control at the circuit assembly, our reflow oven is expediting process development and improves yields.
Where Are PRO 1600 SMT Reflow Ovens Used?
Our SMT ovens are operated by customers in various industries whether they are building a few boards at a time or hundreds per production lot. Advanced process control capabilities enable customers to achieve production oven quality and consistency. Most customers are focused on quality and reflow process control rather than throughput per hour. Main aspects of the oven include “10 zone profiling in a compact footprint”, precise thermal uniformity during reflow soldering along with software monitored forced air/nitrogen convection process. Ultimately, PRO 1600 reflow oven is for those customers concerned about quality and process control first and foremost.
Our solder reflow oven is ideal for reflow soldering in:
- Low – Medium Production Environments
- Prototype and R&D / Engineering Laboratories
- Cell or Batch Production
- High Mix assemblies up to 20″ x 20″ x 4″ (5″ height optional)
Our Soldering Machines and Solder Reflow
Ovens Prevent Common Issues
Reliable and uniform heating throughout the reflow soldering process is paramount for consistency in applications ranging from prototype builds to high-reliability production boards. Our precision temperature control features enable real-time monitoring for detailed profile data collection, reliable heating uniformity, and unparalleled production within high-end soldering applications.
Consistency across the thermal spectrum prevents overheating of components and is further enhanced by our optional External Thermocouple Control (ETC) for accurate temperature readings of the circuit assembly. With low-end reflow ovens, temperature inconsistencies are common within the reflow oven chamber as air temperature readings do not always reflect the precise temperature at the assembly. This leads to inconsistent heating profiles across the various components, resulting in weaker solder joints and potential circuit failures. Our ETC technology solves this issue.
Soldering Machines and Reflow Ovens
For High-End Demands
We proudly serve companies throughout diverse industries across the world with our soldering oven and soldering circuit board platforms. From aerospace technologies to prototype development, our advanced equipment makes soldering circuit boards accessible to companies everywhere.
Our PCB reflow ovens and soldering machines come in a variety of styles to suit your needs. For smaller batch production and unique solder reflow oven needs, we offer small reflow ovens and benchtop reflow ovens. Our small reflow ovens and benchtop reflow ovens are ideal for circuit repair, delicate component manufacturing, and a variety of research and development applications.
Our standalone PCB soldering machines and SMT ovens are compact. When valuable production space is at a premium, implementing a small reflow oven or a benchtop reflow oven into your space provides unobtrusive access to the professional features found within larger commercial reflow ovens.
Advanced Technical Service Included With Our Soldering Machines
When you partner with ATCO for your soldering machine and PCB reflow oven needs, our products are backed by a 5-year warranty. Our reflow soldering machines and PCB reflow ovens are covered for parts and labor and include professional installation, repair, and training. Unlike other PCB soldering machine manufacturers that only deliver, our company is focused on providing long-term support for all of your future soldering circuit board needs.
Video: Reflow Oven for Printed Circuit Board soldering
Learn More About Our Reflow Soldering Machines
Our professional technicians offer complete reflow soldering machines and prototype reflow oven installation, calibration, and guidance. With PCB soldering machines and SMT reflow ovens designed to last, our superlative products are the perfect addition to your business for all of your soldering furnace needs.
Beyond the extensive soldering circuit board and soldering oven solutions we provide, we also produce a reflow simulator for advanced microvia and IPC D coupon testing. Compatible with a variety of custom coupons and requiring minimal operator involvement, our reflow simulator provides ultra-accurate data reports and assembly analysis with simplicity.
If you would like to get in touch with our expert soldering circuit board and soldering oven team, give us a call for more information. We are happy to discuss your soldering oven requirements in detail, and will gladly come up with realistic solutions for your team so you can begin soldering circuit boards with detailed precision today!
PRO 1600 is a forced air / nitrogen convection reflow oven with a small footprint measuring only 31″ x 31″ (80cm x 80cm). It has been designed for reflow soldering of even the most challenging applications including metal core, high thermal mass, RF / microwave housings, wafer boards, and ceramic assemblies. PRO 1600 is very user friendly in terms of profile creation and modification. Sealed heating chamber enables ramp up rates of up to 4° Celsius/second from ambient and programming of up to 10 profile zones. It offers a unique On-The-Fly settings adjustment capability that allows creating and optimizing profiles all in a single pass. Where other batch and conveyor ovens fail to meet the desired profile curve, PRO 1600 excels.
Precise software control delivers unsurpassed temperature uniformity. Maintaining a low delta T across all of the components on the assembly ensures that they are not overheated or thermally stressed. Even for prototypes, this often means avoiding to spend hours of testing and debugging failed boards. With the optional External Thermocouple Control (ETC), profiles may be processed based on temperature readings of the assembly, not the air temperature around it. An optional Video Recording and Observation Module allows taking high magnification images and recording video during a soldering cycle. Increased productivity, superior performance and ease of operation make the PRO 1600 a versatile system ideal for small to medium run production, prototyping, NPI, testing or curing.
Why solder in a Nitrogen reflow oven?
Most PCBs are reflowed in an air atmosphere with great results. However, for mission critical or high reliability applications (i.e. aerospace, military, telecommunications) reflow soldering in a Nitrogen gas atmosphere with low levels of Oxygen is common and is a preferred setup. There are two main reasons for this.
First, Nitrogen is an inert gas that is purged in the reflow chamber to displace Oxygen. Low levels of Oxygen (below 500 PPM) mean there is less oxidation at the solder joints when the alloy is in a molten state. This yields metallurgically stronger solder joints with less voiding and in turn higher quality product that is able to withstand longer thermal cycles and pass the required reliability testing. For most applications, Oxygen PPM level below 1,000 may be required however, some specify O2 under 10 PPM which is essentially an Oxygen free environment.
Second main reason for using Nitrogen during reflow soldering is that it allows for a wider process window than traditional air reflow. PCB assemblies that are thermally heavy due to their mass or materials may take too long to get to reflow temperatures. In an air reflow oven, this will cause flux burn off and by the time solder paste reaches melting temperature there may not be enough flux left to remove the oxide film from the board pads to allow for proper wetting of solder. If reflowed in a Nitrogen atmosphere, even if most of the flux is burned off, low concentration of oxygen means there is very little oxides at the pads so oxidation will not interfere with quality of the solder joint formation. This means a PCB may be reflowed with a profile that takes considerably more time than is recommended by the solder paste manufacturer and still have high quality solder joints.
Customer List Financing Available
- Full Convection Air / Nitrogen Reflow
- Up to 10 individually programmable zones
- Small Footprint of 31″ x 31″
- Computer control with unlimited profile storage capacity
- Comprehensive software package with monitoring and profiling capability
- No Warm-Up time required before operating
- Integrated Exhaust / Fume Cleaning Unit
- Nitrogen ready with low rates of consumption
- Optional configuration allows Oxygen levels down to 10 PPM
- External Thermocouple Control
- Automatic Profile Repeat function (up to 10 times)
- Library of predefined profiles
- Password protected login for engineers and operators
- Plug and Operate Configuration
- Minimal maintenance
- Designed and Manufactured in USA
- Printed Circuit Board (PCB) assemblies requiring high quality and repeatable results in prototype – medium volumes (depending on PCB size).
- Single or Double Sided PCB’s with standard or Pb-Free solders.
- Densely populated, metal core, and high thermal mass assemblies.
- Surface Mount Devices per IPC / JEDEC J-STD-020 and JESD22-A113F standards for Leaded and Pb-Free profiles
- Reflow of solder preforms in an inert atmosphere.
- IPC-TM-650 Test Method 2.6.27 – Thermal Stress, Convection Reflow Assembly Simulation / IPC-9631.
- Bare PCB’s to simulate profiles developed for volume production environments.
- Delamination and other quality issues testing on multilayer PCB’s.
- Various composite materials for analysis / testing.
- Ceramic substrates to Gold Plated Nickel / Copper housings using preforms in an atmosphere with <50 PPM of Oxygen.
- Copper heatsinks to PCB’s using preforms.
- Gold / Tin reflow.
- Wafer Bumping with Oxygen levels below 10 PPM
- Preconditioning reflows of IC’s while in extruded aluminum tubes.
- Aluminum pins to a metal housing.
- Flex connector to ceramic substrate.
- Surface Mount Devices / Passive Components to ceramic substrate.
- Connector filters with fluxed preforms.
- LED’s in production quantities.
- Various solder pastes for analysis in an R&D environment.
Unlike a long tunnel or conveyor type SMT reflow oven, PRO 1600 does not need to be pre-heated before it is ready to process PCBs. An operator would simply turn on the power, load the control software and the system is ready for reflow soldering with the chamber at ambient temperature. This is especially helpful in non-production type environments like prototype labs or for small lot runs typically saving 30 minutes or more by eliminating preheating.
When PRO 1600 is turned on, the cover automatically opens while the loading tray slides out slowly for easy access to place down circuit boards. Once PCBs are loaded (either single or double sided), the operator would select an appropriate reflow oven profile from the software screen. A reflow oven profile is a pre-programmed set of parameters like ramp up rate, temperature, time at set temperature, cooling method, etc., that is specific to the PCBs being soldered. The software includes a library of different profiles tailored to the solder type used in the process as well as general size and mass of the circuit board. An operator can create custom profiles for their unique boards or simply optimize the existing profiles.
As the Start icon is activated, the loading tray automatically slides into the reflow chamber at an adjustable and controlled speed. A reflow profile is then processed per the programmed settings. PRO 1600’s control software constantly monitors actual ramp up rates and temperature inside an oven to the programmed values for accuracy. Once the reflow cycle is complete, the cover will open slowly and tray automatically exits from a heating chamber. PRO 1600 is now in a standby mode, ready for a new cycle run.
The following parameters may be programmed for each profile:
- Up to 5 Ramp Up stages ( ° Celsius / second)
- Up to 5 Temperature stages
- Up to 5 Time at Temperature stages
- Up to 4 In-Process Cooling stages
- Final Cooling stage
- Cooling Modes – 4 types
- Initial Lag time to reach low Oxygen level
- Nitrogen purge time
- Automatic Profile Repeat (up to 10 times)
Profiles are developed, stored, and recalled within PRO 1600’s software package. It controls the reflow cycle, automation of process sequences, and automatic execution of safety checks before and during every profile run.
- Real-Time process graphing
- Profile processing based on part / PCB temperature control*
- Profile development with up to 7 thermocouples*
- Library with predefined profiles
- On-The-Fly settings adjustment
- Real- time data recording for documentation and analysis
- Password Protected Access
- User friendly environment
- Designed for Windows® 10 / 11 Pro OS
There are two standard configurations of the PRO 1600 series. They both share the same design and principle of operation. Below is a comparison matrix outlining features of each model. Additionally, various modifications may be made to satisfy specific application requirements. They include higher temperature rating, process video recording, and fixture customization.
| PRO 1600-S | PRO 1600-EXN | |
| Full Convection | X | X |
| Lead Free Compatible | X | X |
| 10 Heating Zones | X | X |
| 2 Cooling Zones | X | X |
| Footprint of 31″ x 31″ | X | X |
| Computer Control | X | X |
| Software Package | X | X |
| Library with 50 profiles | X | X |
| Exhaust / Fume Cleaning | N/A | X |
| Nitrogen Reflow Capable | N/A | X |
| Notebook PC | N/A | X |
| ETC-PRO | O | O |
| MTDA-PRO | O | O |
| DSBF-PRO | O | O |
| ECF-PRO | O | O |
| LCS-PRO | O | O |
| X – Included O – Optional N/A – Not Available | ||
- External Thermocouple Control (Part: ETC-PRO)
- profile is executed based on temperature reading from the application
- allows for both fixed and external thermocouple control
- Multiple Thermocouple Data Acquisition System (Part: MTDA-PRO)
- built-in 7 thermocouple interface controller for profile development
- 7 K-type thermocouples
- Double Sided PCB Fixture (Part: DSBF-PRO)
- External Cooling Fans Module (Part: ECF-PRO)
- Laptop Computer Stand (Part: LCS-PRO)
- Additional Nitrogen line for Oxygen level down to 10 PPM
- Custom Fixtures / Tooling / Height Increased to 5″
- Video Recording and Observation Module (Part: VRM-PRO)
| PRO 1600-S | PRO 1600-EXN | |
| Temperature: | up to 375° Celsiusup to 375° Celsius | up to 375° Celsius |
| Reflow Area: | 20″ x 20″ / 508mm x 508mm | 20″ x 20″ / 508mm x 508mm |
| Topside Clearance: | 4″ / 101mm | 4″ / 101mm |
| Programmable Heating Zones: | 10 | 10 |
| Cooling Zones: | 2 | 2 |
| Heating Type: | Full Forced Air Convection | Full Forced Air or Nitrogen Convection |
| Interior: | Stainless Steel | Stainless Steel |
| Air Requirements: | 80 – 120 PSI @ 0.3 CFM | 80 – 120 PSI @ 0.3 CFM |
| Power Requirements: | 120/208 VAC, 3 Phase, 50 Amp, 50/60 Hz | 120/208 VAC, 3 Phase, 50 Amp, 50/60 Hz |
| Optional | 200-240 VAC, 3 Phase, 50 Amp, 50/60 Hz | 200-240 VAC, 3 Phase, 50 Amp, 50/60 Hz |
| Optional | 380-400 VAC, 3 Phase, 50 Amp, 50/60 Hz | 380-400 VAC, 3 Phase, 50 Amp, 50/60 Hz |
| Peak Power Consumption: | 16 Kw (during ramp up stages of a profile) | 16 Kw (during ramp up stages of a profile) |
| Operating Consumption: | 9 Kw (during reflow) | 9 Kw (during reflow) |
| Warranty: | Five (5) years parts and labor | Five (5) years parts and labor |
| Agency Approval: | CE, NRTL | CE, NRTL |
| Weight: | 176 lbs / 79 Kg | 190 lbs / 86 Kg |
| Dimensions: | 31″L x 31″W x 50″H / 787mm x 787mm x 1270mm | 31″L x 31″W x 50″H / 787mm x 787mm x 1270mm |