AT-GDP SMD & BGA Rework Station

The AT-GDP SMD and BGA rework station features the latest machine vision and thermal process control technologies. PCBs and substrates containing complex components such as BGA, CSP, QFN, Flip Chips, Wafer Level dies, and many other SMD parts are processed with consistently high quality results. Precise mechanics and advanced software simplifies component placement, soldering, and/or rework. Operator involvement is very limited making these systems easy to setup and use.

Available in benchtop and standalone configurations, these machines are ideal for prototype R&D, NPI, Engineering, Failure Analysis labs as well as OEM / CEM production environments. Automation, machines’ capability, and ease of use are critical for both prototype and production volume applications requiring consistency and quality.

Precision design enables ultra accurate placement to within 0.0002″ or 5 microns. A newly implemented software driven Force Measurement System makes it possible to handle even the smallest and fragile devices along with complex packages like stacked dies or Package-On-Package.

Split vision optics allows simultaneous top of the PCB or substrate and bottom of the component viewing to superimpose and align both images. Split imaging is a feature that creates diagonal corner viewing for alignment of larger packages at high magnification.

High quality components within the optics system ensure a clear and distortion free imaging. Precise closed loop reflow process control enables mimicking the original production profile. Software contains a database of predefined profiles which the user selects based on the package and PCB being reworked.

An Automated Profile Generation feature allows the user to develop an optimum profile in a single pass that may be saved for future processing. Profiles may be easily modified, optimized, and stored for future use. Settings can be adjusted on-the-fly while the profile is running.

Software controls reflow via forced air / nitrogen convection top heater, forced air convection localized bottom heater, and a large area Quartz IR preheater. Airflow at the top heater is monitored by the software and delivers excellent temperature uniformity. This guarantees very gentle flow which cannot disturb even the smallest adjacent components like 01005 passives. Controlled cooling of the part and PCB is accomplished via direct air / nitrogen flow at the top nozzle, air flow at the localized bottom heater, and large area underside board cooling.

For high value / reliability assemblies such as in Aerospace, Military, and Medical applications requiring superior quality solder joints, Nitrogen gas may be purged through the top heater as a substitute for air. Numerous industry studies have shown that soldering in a Nitrogen atmosphere yields stronger, higher quality solder joints when compared to soldering using air or IR sources.

This is primarily due to reduction and elimination (when reaching low levels of Oxygen) of oxidation at the bond site. It is especially the case with fine pitch devices where solder paste or flux volume at the pad site is minimal and burns off quickly at higher temperatures. Once flux burns off, good wetting cannot be achieved and results in cold, intermittent solder joint connections.

If reflowed in Nitrogen, even with flux burned off, the blanket of Nitrogen gas will prevent pads and solder bumps from oxidizing. The result is good wetting and ultimately strong quality solder joints. Benefits of soldering in Nitrogen is also documented when processing multi-layer, high thermal mass assemblies especially those with solid ground planes.

As the process window is extended due to longer heating times, solder pastes’ flux burns off and the same poor wetting is observed in coarse pitch as with fine pitch devices. Purging Nitrogen at the top heater extends the process window and allows achieving quality solder joints even if the cycle is considerably longer due to the assemblies heavy thermal mass.

As other machines that our company has been producing for over the past 35 years, AT-GDP was designed to be very easy to use and capable of handling both today’s and tomorrow’s requirements. AT-GDP series offers excellent performance aimed at applications where precision and consistently high quality results matter. Ranging from R&D, engineering departments, to production environments typical of volume repair centers.

Partial Customer List

• Single Axis Placement and Soldering Design
• Split Vision Optics with LED lighting
• Precision Placement within +/- 0.0002″ or 5 microns
• Standard configuration handles devices down to 0.03″Sq or 0.75mmSq (down to 0.4mm x 0.25mm available)
• Air / Nitrogen Top heater and Area Quartz IR / Focused Local Air Preheaters
• Nitrogen soldering and cooling ready
• Force Measurement System with software control
• Computer control with comprehensive software package
• Closed Loop process control
• In Process Jogging of the Reflow Head
• Automated Z axis with 2 stage programmable speed
• Precision board holder with vacuum locking base, X-Y micrometers, underside support
• Compressed air cooling bypassing the heater yields strong, quality joints
• Five thermocouple inputs
• Library of predefined profiles
• Software controlled process sequencing with safety interlocks
• Plug and Operate Configuration
• Minimal operator involvement
• Maintenance Free
• Designed and Manufactured in USA

With a few software clicks, AT-GDP machine will automatically place the component onto the PCB, disengage vacuum holding the part, lift a pick up nozzle away from the package body, process a soldering profile, and raises the reflow head at the completion of a cycle. Removal features the same automation only now, the component is pulled off the board at the completion of a cycle.

The AT-GDP SMD / BGA rework station contains a library of pre-defined thermal profiles as well as customer defined profiles. After inserting the circuit board into the machines board holder, the profile can be selected form the control software and allows processing the component installation or removal without the need for any programming. The operator simply aligns the split vision optics over the PCB and the vacuum tip over a BGA or SMD component to start the removal procedure.

Initiating “Start” in the software commences the cycle with the vacuum tip coming down to the board level and heating is performed as defined by the profile settings. Before cooling is activated, the part is lifted from the board with vacuum and the Z axis reflow head moves up to the initial start position. The part is removed from a board and can be taken off the machine for replacement to begin. From the point that an operator starts the cycle, there is no end user involvement in the process and machine performs rework sequences automatically.

Installation procedure for a BGA, QFN, or other SMD part is very similar to de soldering in that the same thermal reflow profile is selected in the software and split vision optics is used to align part to a circuit board.

When working with BGA, wafer level CSP, flip chip, or QFN, machine allows applying solder paste and rework flux directly to the package. This preparation step is very important in being able to successfully solder a replacement component. Once the component is aligned to pads on the board, an operator would click “Start” and machine will automatically proceed with precision placement and soldering to the circuit board.

There are several useful features especially for engineering or R&D lab environments that process low volume prototype assemblies. They include side view mounted camera which can show the solder reflow process in real time at high magnification, as well as having manual jogging capability of the reflow head during soldering. However, it is strictly up to the operator if the choose to use them in addition to the machine automation. In general, just like in the de soldering procedure, there is no need for operator involvement once they select Start. All functions for successful SMD or BGA rework are performed with machine automation.

Profiles are developed, stored, and recalled in the AT-GDP’s software package. It controls the reflow soldering cycle, automation of process sequences, and automatic execution of safety checks before every profile run.

• Real-Time process graphing
• Automatic Profile Generation
• Profile development with up to 5 external thermocouples
• Library with predefined profiles
• On-The-Fly settings adjustment
• Real – time data recording for documentation and analysis
• Password Protected Access
• Unlimited profile storage
• User friendly environment
• Designed for Windows® 7 Pro / 10 Pro OS

There are three configurations of the AT-GDP series. All of which share the same rigid platform and principle of operation. Below is a comparison matrix indicating features of each model.

• Flux / Solder Paste Transfer Plate Kit (Part: FTP-ATGDP)
• Solder Paste Transfer Stencil (Part: STN-ATGDP)
• BGA Reballing Kit (Part: BRK-ATGDP)
• Split Imaging Alignment (Part: SIA-ATGDP)
• Nozzle Kit – 10 pcs. (Part: NZK-ATGDP)
• 01005 / 0201 Passives Handling (Part: 01005/0201-ATGDP)
• Process Monitoring Camera (Part: PMC-ATGDP)
• Composite fixture for micro substrates / small PCB modules