What is an SMD or BGA rework station?
In electronic assembly, specifically printed circuit board (PCB) assembly and repair, a rework station is equipment that allows for soldering and de-soldering of electronic components. This is done by applying precisely controlled and targeted heating at the component and the PCB until solder joints melt, flow to form a connection, and cool to solidify forming a strong interconnect. SMD (surface mount device) or BGA (ball grid array) refers to the specific type and package layout of electronic component. Most common electronic components that are repaired or reworked today are SMD type and are mounted on the surface of the circuit board, hence their name, surface mount device. A BGA is a subset of surface mount devices, with connections in the form of solder balls arranged in a grid array under the package die. In order to safely repair or replace such components, a rework station must have more advanced features than a traditional SMD rework station. This includes machine vision like split vision optics, precision device placement and removal capability, and computer controlled thermal cycling. This is why in the industry a “BGA rework station” is a term used to describe a more advanced rework station capable of handling general SMD components but also specifically BGAs.
What is a reflow oven?
The process of soldering electronic components specifically, surface mount devices, onto circuit boards during PCB assembly involves heating the circuit board until solder paste melts and creates a solder joint. This is performed in a machine called a reflow oven or reflow soldering oven. There are various types like small benchtop, standalone, batch, and inline conveyor systems. Heating technologies also vary and include air or nitrogen convection, infra-red, vapor phase, and conduction. For volume production environments, a large inline convection oven (15ft – 20ft long) is preferred as it allows to streamline the SMT assembly process and has high throughput. For small volume applications, a batch reflow oven is best if it does not sacrifice performance and profiling capability. This is especially the case when a facility has limited floor space. There is no one fit solution for every product and some types are better suited for specific applications and throughput requirements.
The AT-GDP Series SMD and BGA Rework Stations feature the latest machine vision and thermal process control technologies.
The AT-DB Flip Chip Die Bonders enable bonding via solder attach, thermal compression, and epoxy die attach processes.
PRO 1600 is a forced air / nitrogen convection reflow oven with only a 31" x 31" footprint of floor space.
PRO 1600-RS / RST is specifically configured for reflow simulation, SMD package qualification, solderability, and thermal stress testing applications.
Demonstration of a Wafer Level Chip Scale Package (WLCSP) being removed and installed on a printed circuit board using an AT-GDP Placement and Rework Station.
Side view of a BGA component being reflowed.
Overview of PRO 1600 Forced Convection Reflow Oven in operation. Features include small footprint (31" x 31"), lead free reflow capable, and precise software process control.
Installation process of a BGA component using the AT-GDP BGA / SMT Placement & Rework Station.
Advanced Techniques US Inc. (ATCO) designs and manufacturers precision equipment for reflow soldering, SMD / BGA rework, Flip Chip bonding, JEDEC reflow, and IPC D coupon testing applications. Our product line consists of SMD / BGA Placement & Rework Stations, Flip Chip Bonders, Reflow Soldering Ovens, Reflow Simulators for SMD Preconditioning and PCB Coupon Thermal Stress Testing, and SMT Pick & Place equipment ideal for environments with prototype to medium volumes. By working closely with a customer to fully understand and identify application requirements, we are able to offer an ideal solution.