Reflow Simulator for JEDEC Reflow Profiles
and IPC D Coupon Testing

PRO 1600-RS / RST is designed for reflow simulation, SMD package qualification, solderability and thermal stress testing applications. This includes JEDEC reflow, IPC D coupon testing, preconditioning of SMDs per JESD22-A113 standard, solderability test per J-STD-002 E (SMD Reflow), Moisture Sensitivity Level (MSL) testing of SMD packages per JEDEC J-STD-020 E, and microvia testings for reliability on IPC D coupons per IPC-TM-650 2.6.27 Rev.B – Thermal Stress Convection Reflow Assembly Simulation..

What are D coupons?

In Printed Circuit Board (PCB) fabrication process, coupons are small representative samples of the actual bare board. They are built on the same PWB along the perimeter of a panel. Coupons are of the same material containing comparable traces and structures like vias, microvias, etch, drill, soldermask as the actual manufactured PWB panel. Typically, there are at least several coupons per panel and once built they are routed out and used for PWB reliability testing purposes. IPC D coupons are designed per IPC 2221B Appendix A standard for screening and detecting weak microvia structures. The D coupons are subjected to multiple reflow cycles (6X minimum) as outlined in IPC TM-650 2.6.27 Rev. B, and continuously measured for change in resistance. Being able to measure resistance through the entire reflow process in the only reliable method to date of capturing failures on the D coupons.

PRO 1600-RST model is specifically configured for reflow simulation of IPC D coupons per IPC-TM-650 2.6.27 Rev. B (Thermal Stress-Convection Reflow Assembly Simulation) as outlined in an industrywide warning statement published within IPC 6012 E for microvia reliability testing. In order to catch microvia failures, system implements a continuous resistance Ohm measurement during the entire reflow process. Up to forty-eight (48) IPC-2221B Appendix A, D coupons may be processed per lot with resistance data read once per channel net every second. When subjected to a minimum of 6 reflow cycles (programmable up to 250 cycles), each lot takes approximately 1 hour to complete and is performed automatically without any operator involvement between reflows. Lots may also be processed until net failure is detected and is typically set to 5% change in resistance. At completion of testing, system automatically generates a detailed report with Pass / Fail results summary and detailed resistance data for each coupon net. Interchangeable carriers allow processing other IPC or custom designed coupons. IPC D Coupon Testing is now available as a service on an as needed basis. Contact us for a quote!

What is JEDEC J-STD-020?

An industry standard test method for moisture level and reflow sensitivity classification of nonhermetic surface mount devices (SMDs). Originally published in 1996, it has been updated several times with the latest revision E issued in 2014 addressing higher temperature reflow profiles for lead free assemblies. Plastic encapsulated SMDs are prone to moisture absorption when stored outside of dry boxes or vacuum sealed packaging. The trapped moisture can lead to component damage during reflow soldering in the assembly process. J-STD-020E outlines test procedure and moisture sensitivity level (MSL) classification of such parts for proper packaging, storage, handling, and solder reflow limits. SMD component manufacturers and fabless semiconductor companies must subject packages to multiple JEDEC reflow profile cycles as outlined in the standard to test part survivability in assembly processing at peak solder reflow temperatures. Typically, SMDs are processed through a reflow profile at least 3X to simulate a double sided PCB assembly process and one more cycle in case of rework or repair. Post reflow cycling, the parts are inspected (visual, microscopy, and/or electrical test) for any damage to the package like cracking, delamination, warping, internal die damage. They are then classified for survivability at tin-lead or lead-free temperatures thus, allowing the customer and assembler to process builds at safe temperatures not to inflict component or internal die damage.

Instead of performing reflows in an inline tunnel oven which typically range 12 ft. – 20 ft. in length, the batch design of this reflow simulator enables processing is a compact footprint of only 31″ x 31″. All while maintaining profiling flexibility, control, and consistency of a production reflow oven. A unique feature to the PRO 1600-RS is the automatic profile repeat feature. It allows a profile to cycle automatically multiple times without any operator intervention. For SMD preconditioning and reflow simulation of surface mount parts, the standards require parts to be cycled 3X. Therefore, automating the process not only eliminates operator involvement in tracking and handling each pass, but also ensures consistency of each cycle and integrity of the test. Additional information and details of this feature are explained in paper titled Automating Preconditioning and Package Qualification Reflow Cycles

A proprietary design allows achieving temperature ramp up rates of up to 4° Celsius/second from ambient and programming of up to 10 profile zones. Warming up the oven prior to loading product and starting is not required as is the case with other smaller benchtop reflow systems. This ensures consistency since the product starts a reflow profile while at or near ambient temperatures for every cycle. On-the-fly settings adjustment capability allows creating and optimizing profiles all in a single pass. Precise software control delivers unsurpassed temperature uniformity. An optional Video Recording and Observation Module allows taking high magnification images and recording video during a soldering cycle.

Contact us and discover why leading semiconductor and printed circuit fabrication companies prefer PRO 1600-RS reflow simulator for their preconditioning, package qualification, and thermal stress testing needs.

Customer List        Send Samples for Evaluation

• Full Convection Reflow Simulator
• Up to 10 individually programmable zones
• Small Footprint of 31″ x 31″ / 34″ x 34″ on PRO 1600 RST
• Designed for weak microvia reliability testing per IPC 6012 E and IPC-TM-650 2.6.27 Rev. B (PRO 1600 RST)
• Test up to 48 IPC D coupons (PRO 1600 RST)
• Computer control with comprehensive data logging and recording
• Multiple Thermocouple Data Acquisition System
• External Cooling Fans Module for rapid cooling of the product
• No Warm-Up time required before operating
• Integrated Exhaust Unit
• Nitrogen compatible
• External Thermocouple Control
• Automatic Profile Repeat function
• Plug and Operate Configuration
• Designed and Manufactured in USA

Profiles are developed, stored, and recalled within PRO 1600’s software package. It controls the reflow cycle, automation of process sequences, and automatic execution of safety checks before and during every profile run.

• Real-Time process graphing
• Profile processing based on part / PCB temperature control*
• Profile development with up to 7 thermocouples
• Library with predefined profiles
• On-The-Fly settings adjustment
• Real- time data recording for documentation and analysis
• Password Protected Access
• User friendly environment
• Designed for Windows® 10 / 11 Pro OS

• External Thermocouple Control (Part: ETC-PRO)
  • profile is executed based on temperature reading from the product
  • interchangeable between fixed and external thermocouple controls
• Double Sided PCB Fixture (Part: DSBF-PRO)
• Laptop Computer Stand (Part: LCS-PRO)
• 400 VAC 3 Phase Electrical Configuration
• Custom Fixtures / Trays and Cable Feed-Throughs
• Video Recording and Observation Module (Part: VRM-PRO)