The AT-GDP Series SMD and BGA Rework Stations feature the latest machine vision and thermal process control technologies.
The AT-DB Flip Chip Die Bonders enable bonding via solder attach, thermal compression, and epoxy die attach processes.
PRO 1600 is a forced air / nitrogen convection reflow oven with only a 31" x 31" footprint of floor space.
PRO 1600-RS / RST is specifically configured for reflow simulation, SMD package qualification, solderability, and thermal stress testing applications.
The CAT90-SA pick and place systems are semi-automatic machines featuring software guidance and the latest high resolution vision technology.
Request Brochure and Pricing