The AT-GDP Series SMD and BGA Rework Stations feature the latest machine vision and thermal process control technologies.
The AT-DB Flip Chip Die Bonders enable bonding via solder attach, thermal compression, and epoxy die attach processes.
PRO 1600 is a forced air / nitrogen convection reflow oven with only a 31" x 31" footprint of floor space.
PRO 1600-RS / RST is specifically configured for reflow simulation, SMD package qualification, solderability, and thermal stress testing applications.
Demonstration of a Wafer Level Chip Scale Package (WLCSP) being removed and installed on a printed circuit board using an AT-GDP Placement and Rework Station.
Side view of a BGA component being reflowed.
Overview of PRO 1600 Forced Convection Reflow Oven in operation. Features include small footprint (31" x 31"), lead free reflow capable, and precise software process control.
Installation process of a BGA component using the AT-GDP BGA / SMT Placement & Rework Station.
Advanced Techniques US Inc. (ATCO) designs and manufacturers precision equipment for reflow soldering, SMD / BGA rework, Flip Chip bonding, JEDEC reflow, and IPC D coupon testing applications. Our product line consists of SMD / BGA Placement & Rework Stations, Flip Chip Bonders, Reflow Soldering Ovens, Reflow Simulators for SMD Preconditioning and PCB Coupon Thermal Stress Testing, and SMT Pick & Place equipment ideal for environments with prototype to medium volumes. By working closely with a customer to fully understand and identify application requirements, we are able to offer an ideal solution.