Reflow Simulator for JEDEC Reflow Profiles and IPC D Coupon Testing

We are proud to offer the PRO 1600-RS reflow simulator for improved solderability tests worldwide. Our Jedec reflow testing platform adheres to the strict J-STD-020 standard for package survivability and Jedec reflow simulation, providing consistently accurate data for validated production that meets strict qualifications at every level of development.

What Is The PRO 1600-RS / RST Reflow Simulator Used For?

Our PRO 1600-RS thermal stress tester combines reliable solderability testing with the best in user-friendly operation. Our PRO 1600-RS is a Jedec J-STD-020 compliant reflow simulator with a variety of diverse capabilities for thorough solderability tests that improve circuit assembly viability with accurate analysis and superior package qualification. Industries from aerospace to advanced research and development firms trust our Jedec J-STD-020 compliant equipment for precision results with:

  • SMD Package Qualification
  • Thermal Stress Testing
  • Solderability Testing
  • IPC d Coupon Testing
  • & More

Our Jedec reflow thermal stress tester and reflow simulator reduce operator error by automating much of the jedec reflow process. Unlike other solderability test devices that require manual input between reflow cycles, our user-friendly platform allows for repeat testing utilizing automated cycling of reflow profiles. With fully adjustable parameters throughout cycle development, SMD parts and PCB coupons may be optimized to custom thermal cycle specifications.

Following IPC TM 650 2.6.27, our solderability test platform reliably simulates real-world assembly thermal cycles. With our automated process, IPC TM 650 2.6.27 thermal stress and J-STD-020 qualifications are achieved with minimal user input. With up to 250x redundant reflow cycles available with pre-programmable profiles, your staff can focus on other tasks and leave the IPC d coupon testing and IPC TM 650 2.6.27 qualifications up to our powerful reflow simulator.

Meet J-STD-020 Compliance With Ease

By investing in jedec reflow equipment that provides reliable J-STD-020 compliant results, you protect your valuable products and ensure the quality of production. Accurate PCB coupon testing is necessary to avoid circuit failures and provide consistently superior products to your customers; our J-STD-020 compliant machines prevent potential circuit damage due to moisture absorption or damaging solder reflow temperatures. With our safe and proven equipment, you can expect quality preconditioning, precision package qualification data, and thermal stress testing in the industry.

Our reflow simulator is convenient for multiple environments. Focused on empowering companies of all sizes with our proven d coupon testing method, our reflow simulator is compact, only 31”x”31, allowing for professional quality batch testing without the large square footage associated with other reflow simulators on the market.

PRO1600RSTBrochure 3

Learn More About Our PCB Soldering Solutions

Beyond meeting and exceeding the J-STD-020, d coupon, and PCB coupon testing reflow simulator, we provide inclusive installation and training with all of our advanced equipment; from solder reflow ovens to our benchtop SMD rework stations, we will support you every step of the way.

Our proficient engineers and technicians are the best in the business; we provide calibrations, operational assistance, and follow-up service long into the future. Our friendly team values your business and will go above and beyond to serve your company with professionalism and expertise. If you would like to learn more about our various PCB solutions, please give us a call today!

Reach Out to Us to Learn More

PRO 1600-RS / RST is designed for reflow simulation, SMD package qualification, solderability and thermal stress testing applications. This includes JEDEC reflow, IPC D coupon testing, preconditioning of SMDs per JESD22-A113 standard, solderability test per J-STD-002 E (SMD Reflow), Moisture Sensitivity Level (MSL) testing of SMD packages per JEDEC J-STD-020 E, and microvia testings for reliability on IPC D coupons per IPC-TM-650 2.6.27 Rev.B – Thermal Stress Convection Reflow Assembly Simulation..

What are D coupons?

In Printed Circuit Board (PCB) fabrication process, coupons are small representative samples of the actual bare board. They are built on the same PWB along the perimeter of a panel. Coupons are of the same material containing comparable traces and structures like vias, microvias, etch, drill, soldermask as the actual manufactured PWB panel. Typically, there are at least several coupons per panel and once built they are routed out and used for PWB reliability testing purposes. IPC D coupons are designed per IPC 2221B Appendix A standard for screening and detecting weak microvia structures. The D coupons are subjected to multiple reflow cycles (6X minimum) as outlined in IPC TM-650 2.6.27 Rev. B, and continuously measured for change in resistance. Being able to measure resistance through the entire reflow process in the only reliable method to date of capturing failures on the D coupons.

PRO 1600-RST model is specifically configured for reflow simulation of IPC D coupons per IPC-TM-650 2.6.27 Rev. B (Thermal Stress-Convection Reflow Assembly Simulation) as outlined in an industrywide warning statement published within IPC 6012 E for microvia reliability testing. In order to catch microvia failures, system implements a continuous resistance Ohm measurement during the entire reflow process. Up to forty-eight (48) IPC-2221B Appendix A, D coupons may be processed per lot with resistance data read once per channel net every second. When subjected to a minimum of 6 reflow cycles (programmable up to 250 cycles), each lot takes approximately 1 hour to complete and is performed automatically without any operator involvement between reflows. Lots may also be processed until net failure is detected and is typically set to 5% change in resistance. At completion of testing, system automatically generates a detailed report with Pass / Fail results summary and detailed resistance data for each coupon net. Interchangeable carriers allow processing other IPC or custom designed coupons. IPC D Coupon Testing is now available as a service on an as needed basis. Contact us for a quote!

What is JEDEC J-STD-020?

An industry standard test method for moisture level and reflow sensitivity classification of nonhermetic surface mount devices (SMDs). Originally published in 1996, it has been updated several times with the latest revision E issued in 2014 addressing higher temperature reflow profiles for lead free assemblies. Plastic encapsulated SMDs are prone to moisture absorption when stored outside of dry boxes or vacuum sealed packaging. The trapped moisture can lead to component damage during reflow soldering in the assembly process. J-STD-020E outlines test procedure and moisture sensitivity level (MSL) classification of such parts for proper packaging, storage, handling, and solder reflow limits. SMD component manufacturers and fabless semiconductor companies must subject packages to multiple JEDEC reflow profile cycles as outlined in the standard to test part survivability in assembly processing at peak solder reflow temperatures. Typically, SMDs are processed through a reflow profile at least 3X to simulate a double sided PCB assembly process and one more cycle in case of rework or repair. Post reflow cycling, the parts are inspected (visual, microscopy, and/or electrical test) for any damage to the package like cracking, delamination, warping, internal die damage. They are then classified for survivability at tin-lead or lead-free temperatures thus, allowing the customer and assembler to process builds at safe temperatures not to inflict component or internal die damage.

Instead of performing reflows in an inline tunnel oven which typically range 12 ft. – 20 ft. in length, the batch design of this reflow simulator enables processing is a compact footprint of only 31″ x 31″. All while maintaining profiling flexibility, control, and consistency of a production reflow oven. A unique feature to the PRO 1600-RS is the automatic profile repeat feature. It allows a profile to cycle automatically multiple times without any operator intervention. For SMD preconditioning and reflow simulation of surface mount parts, the standards require parts to be cycled 3X. Therefore, automating the process not only eliminates operator involvement in tracking and handling each pass, but also ensures consistency of each cycle and integrity of the test. Additional information and details of this feature are explained in paper titled Automating Preconditioning and Package Qualification Reflow Cycles

A proprietary design allows achieving temperature ramp up rates of up to 4° Celsius/second from ambient and programming of up to 10 profile zones. Warming up the oven prior to loading product and starting is not required as is the case with other smaller benchtop reflow systems. This ensures consistency since the product starts a reflow profile while at or near ambient temperatures for every cycle. On-the-fly settings adjustment capability allows creating and optimizing profiles all in a single pass. Precise software control delivers unsurpassed temperature uniformity. An optional Video Recording and Observation Module allows taking high magnification images and recording video during a soldering cycle.

Contact us and discover why leading semiconductor and printed circuit fabrication companies prefer PRO 1600-RS reflow simulator for their preconditioning, package qualification, and thermal stress testing needs.

Customer List        Send Samples for Evaluation

  • Full Convection Reflow Simulator
  • Up to 10 individually programmable zones
  • Small Footprint of 31″ x 31″ / 34″ x 34″ on PRO 1600 RST
  • Designed for weak microvia reliability testing per IPC 6012 E and IPC-TM-650 2.6.27 Rev. B (PRO 1600 RST)
  • Test up to 48 IPC D coupons (PRO 1600 RST)
  • Computer control with comprehensive data logging and recording
  • Multiple Thermocouple Data Acquisition System
  • External Cooling Fans Module for rapid cooling of the product
  • No Warm-Up time required before operating
  • Integrated Exhaust Unit
  • Nitrogen compatible
  • External Thermocouple Control
  • Automatic Profile Repeat function
  • Plug and Operate Configuration
  • Designed and Manufactured in USA

Profiles are developed, stored, and recalled within PRO 1600’s software package. It controls the reflow cycle, automation of process sequences, and automatic execution of safety checks before and during every profile run.

  • Real-Time process graphing
  • Profile processing based on part / PCB temperature control*
  • Profile development with up to 7 thermocouples
  • Library with predefined profiles
  • On-The-Fly settings adjustment
  • Real- time data recording for documentation and analysis
  • Password Protected Access
  • User friendly environment
  • Designed for Windows® 10 Pro OS
  • External Thermocouple Control (Part: ETC-PRO)
    • profile is executed based on temperature reading from the product
    • interchangeable between fixed and external thermocouple controls
  • Double Sided PCB Fixture (Part: DSBF-PRO)
  • Laptop Computer Stand (Part: LCS-PRO)
  • 400 VAC 3 Phase Electrical Configuration
  • Custom Fixtures / Trays and Cable Feed-Throughs
  • Video Recording and Observation Module (Part: VRM-PRO)
PRO 1600-RS
Temperature: up to 375° Celsius
Reflow Area: 20″ x 20″ / 508mm x 508mm
Topside Clearance: 4″ / 101mm
Programmable Heating Zones: 10
Cooling Zones: 2
Heating Type: Full Forced Air / Nitrogen Convection
Interior: Stainless Steel
Air Requirements: 80 – 120 PSI @ 0.3 CFM
Power Requirements: 120/208 VAC, 3 Phase, 50 Amp, 50/60 Hz
Optional 125/250 VAC, 1 Phase, 50 Amp, 50/60 Hz
Optional 200-240 VAC, 3 Phase, 50 Amp, 50/60 Hz
Optional 380-400 VAC, 3 Phase, 50 Amp, 50/60 Hz
Peak Power Consumption: 16 Kw (during ramp up stages of a profile)
Operating Consumption: 9 Kw (during reflow)
Warranty: Five (5) years parts and labor
Agency Approvals: CE
Weight: 185 lbs / 84 Kg
Dimensions: 31″L x 31″W x 50″H / 787mm x 787mm x 1270mm
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