Flip Chip and Die Bonder for Solder Attach and Thermo compression Bonding

The AT-DB Flip Chip Die Bonders enable bonding via solder attach, thermal compression, and epoxy die attach processes. Precise mechanics and advanced software simplifies the optical alignment, placement, and bonding stages of the process. Operator involvement is limited making these systems easy to setup and use. Available in benchtop and standalone configurations, these machines are ideal for prototype R&D, NPI, Engineering, Failure Analysis labs as well as OEM / CEM production environments. Automation, machines' capability, and ease of use are critical for both prototype and production volume applications requiring consistency and quality.

Solid design enables ultra precise placement of flip chips and dies to within 0.0002" or 5 microns. A newly implemented software driven Force Measurement System makes it possible to handle fragile dies down to 0.2mm x 0.2mm. Alignment is performed using split vision optics allowing simultaneous view of the substrate and flip chip / die. The two images are superimposed using micrometers on a precision vacuum locking stage. Software contains a database of predefined profiles which the user selects based on the die and substare. Profiles may be easily modified, optimized, and stored for future use. Settings can be adjusted on-the-fly while the profile is running. Software controlled heating at the die is performed via a convection Air / Nitrogen heater. Substrate can be heated via a conductive as well as a convective stage heaters. Critical process parameters like bonding force, heating ramp up rates, temperatures, dwell times, gas flow, and cooling rates are monitored by the software to deliver consistent quality.

Like other machines that our company has been producing for past 30 years, AT-DB was designed to be very easy to use and capable of handling both today’s and tomorrow’s requirements. AT-DB series offers unparalleled performance aimed at applications where precision and consistently high quality results matter. Ranging from R & D, NPI, Engineering, and batch production environments.

• Single Axis Placement and Heating
• Split Vision Optics with LED lighting
• Precision Placement within +/- 0.0002" or 5 microns
• Software controlled Bonding Force up to 300 Newtons
• Fluxing Station for bumped Flip Chip attachment
• Convection Air / Nitrogen Gas Topside heater
• Conductive stage and Convection substrate heaters
• Force Measurement System with software control
• Comprehensive software package
• In Process Adjustment capability
• Automated Z axis with 2 stage programmable speed
• Precision substrate stage with vacuum locking base
• Waffle Pack tray holder
• Feeder for handling 8mm tape
• Side Mounted Process Monitoring Camera
• Plug and Operate Configuration
• Minimal operator involvement
• Maintenance Free
• Designed and Manufactured in USA

• Flip Chip to substrate / PCB via solder attach process
• Flip Chip / Die to substrate via thermo compression bonding
• Flip Chip / die attachment using non conductive paste
• Die to substrate via bumped copper pillars
• Conductive epoxy die attachment

Profiles are developed, stored, and recalled in the AT-DB’s software package. It controls the heating cycle, bonding force, automation of process sequences, and automatic execution of safety checks before every profile run.

• Real-Time process graphing
• Library with predefined profiles
• On-The-Fly settings adjustment
• Real - time data recording for documentation and analysis
• Password Protected Access
• Unlimited profile storage
• User friendly environment
• Designed for Windows® 7 Pro / 10 Pro OS

• Fluxing Station
• Waffle Pack Tray holder
• Solder Paste / Epoxy Dispenser
• Nozzle Kit
• Process Monitoring Camera
• Composite fixture for micro substrates / small PCB modules