The AT-GDP Series SMD and BGA Rework Stations feature the latest machine vision and thermal process control technologies.

The AT-DB Flip Chip Die Bonders enable bonding via solder attach, thermal compression, and epoxy die attach processes.

PRO 1600-RS / RST is specifically configured for reflow simulation, SMD package qualification, solderability, and thermal stress testing applications.

The CAT90-SA pick and place systems are semi-automatic machines featuring software guidance and the latest high resolution vision technology.