PRO 1600-RS is specifically configured for reflow simulation, package qualification, solderability and thermal stress testing applications. This includes Preconditioning of Nonhermetic Surface Mount Devices (SMD) per JESD22-A113 standard, Solderability test per J-STD-002 E, Moisture Sensitivity Level (MSL) testing of packages per IPC / JEDEC J-STD-020 E, and thermal stress testings as performed by PCB fabricators to IPC-TM-650 Test Method 2.6.27 / IPC-9631 standards. Instead of performing reflows in an inline tunnel oven which typically range 12 ft. - 20 ft. in length, the batch design of this reflow simulator enables processing is a compact footprint of only 31" x 31". All while maintaining profiling flexibility, control, and consistency of a production reflow oven. A unique feature to the PRO 1600-RS is the automatic profile repeat feature. It allows a profile to cycle automatically multiple times without any operator intervention. For SMD preconditioning and reflow simulation of surface mount parts, the standards require parts to be cycled 3X. For board coupon reflow, tests require 6X or more until failure is detected. Therefore, automating the process not only eliminates operator involvement in tracking and handling each pass, but also ensures consistency of each cycle and integrity of the test. Additional information and details of this feature are explained in papers titled Automating Preconditioning and Package Qualification Reflow Cycles and Automating Thermal Stress Reflow Simulation on PCB's
A proprietary design allows achieving temperature ramp up rates of up to 4° Celsius/second from ambient and programming of up to 10 profile zones. Warming up the oven prior to loading product and starting is not required as is the case with other smaller benchtop reflow systems. This ensures consistency since the product starts a reflow profile while at or near ambient temperatures for every cycle. On-the-fly settings adjustment capability allows creating and optimizing profiles all in a single pass. Precise software control delivers unsurpassed temperature uniformity. An optional Video Recording and Observation Module allows taking high magnification images and recording video during a soldering cycle.
Contact us and discover why some of the leading semiconductor and printed circuit fabrication companies prefer PRO 1600-RS reflow simulator for their preconditioning, package qualification, and thermal stress testing needs.
Once power is turned on, the top cover automatically opens while the loading tray slides out. Parts are loaded onto a mesh tray and the profile is selected with a few mouse clicks.
After the Start icon is activated, the tray automatically slides into the heating chamber at an adjustable and controlled speed. A profile is then executed as per the pre-programmed parameters. Software constantly monitors actual ramp up rates and temperature inside an oven to the programmed values for accuracy. At the completion of a reflow cycle, the tray automatically exits from a heating chamber. PRO 1600 is now in a standby mode, ready for a new cycle run.
Profiles are developed, stored, and recalled within PRO 1600’s software package. It controls the reflow cycle, automation of process sequences, and automatic execution of safety checks before and during every profile run.
|Temperature:||up to 375° Celsius|
|Reflow Area:||20" x 20" / 508mm x 508mm|
|Topside Clearance:||4" / 101mm|
|Programmable Heating Zones:||10|
|Heating Type:||Full Forced Air / Nitrogen Convection|
|Air Requirements:||80 - 120 PSI @ 0.3 CFM|
|Power Requirements:||120/208 VAC, 3 Phase, 50 Amp, 50/60 Hz|
|Optional||125/250 VAC, 1 Phase, 50 Amp, 50/60 Hz|
|Optional||200-240 VAC, 3 Phase, 50 Amp, 50/60 Hz|
|Optional||380-400 VAC, 3 Phase, 50 Amp, 50/60 Hz|
|Peak Power Consumption:||16 Kw (during ramp up stages of a profile)|
|Operating Consumption:||9 Kw (during reflow)|
|Warranty:||Five (5) years parts and labor|
|Weight:||185 lbs / 84 Kg|
|Dimensions:||31"L x 31"W x 50"H / 787mm x 787mm x 1270mm|