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PRO 1600-RS Reflow Simulator

Product Overview

PRO 1600-RS is specifically configured for reflow simulation and thermal stress testing applications. This includes Preconditioning of Nonhermetic Surface Mount Devices (SMD) per JESD22-A113F standard, Moisture Sensitivity Level (MSL) testing of semiconductors per IPC / JEDEC J-STD-020D, and thermal stress testings as performed by PCB fabricators to IPC-TM-650 Test Method 2.6.27 / IPC-9631 standards. Instead of performing reflows in an inline tunnel oven which typically range 12 ft. - 20 ft. in length, the batch design of this reflow simulator enables processing is a compact footprint of only 31" x 31". All while maintaining profiling flexibility, control, and consistency of a production reflow oven. A unique feature to the PRO 1600-RS is the automatic profile repeat feature. It allows a profile to cycle automatically multiple times without any operator intervention. For SMD preconditioning and reflow simulation of surface mount parts, the standards require parts to be cycled 3X. For board coupon reflow, tests require 6X or more until failure is detected. Therefore, automating the process not only saves a considerable amount of time but also ensures consistency of each cycle and integrity of the test. Additional information and details of this feature are explained in papers titled Automating Solder Reflow Simulation per IPC/JEDEC J-STD-020D.1 and Automating Thermal Stress Reflow Simulation on PCB's

A proprietary design allows achieving temperature ramp up rates of up to 4° Celsius/second from ambient and programming of up to 10 profile zones. Warming up the oven prior to loading product and starting is not required as is the case with other smaller benchtop reflow systems. This ensures consistency since the product starts a reflow profile while at or near ambient temperatures for every cycle. On-the-fly settings adjustment capability allows creating and optimizing profiles all in a single pass. Precise software control delivers unsurpassed temperature uniformity. An optional Video Recording and Observation Module allows taking high magnification images and recording video during a soldering cycle.

Contact us and discover why some of the leading semiconductor and printed circuit board fabricator companies prefer PRO 1600-RS reflow simulator for their preconditioning, MSL, and thermal stress testing qualifications.

References          Send Samples for Evaluation

 

Key Features

  • Full Convection Reflow Simulator
  • Up to 10 individually programmable zones
  • Small Footprint of 31" x 31"
  • Computer control with comprehensive data logging and recording
  • Multiple Thermocouple Data Acquisition System
  • External Cooling Fans Module for rapid cooling of the product
  • No Warm-Up time required before operating
  • Integrated Exhaust Unit
  • Nitrogen compatible
  • External Thermocouple Control
  • Automatic Profile Repeat function (up to 10 times)
  • Plug and Operate Configuration
  • Designed and Manufactured in USA

 

Operation

Once power is turned on, the top cover automatically opens while the loading tray slides out. Parts are loaded onto a mesh tray and the profile is selected with a few mouse clicks.

After the Start icon is activated, the tray automatically slides into the heating chamber at an adjustable and controlled speed. A profile is then executed as per the pre-programmed parameters. Software constantly monitors actual ramp up rates and temperature inside an oven to the programmed values for accuracy. At the completion of a reflow cycle, the tray automatically exits from a heating chamber. PRO 1600 is now in a standby mode, ready for a new cycle run.

 

Software

Profiles are developed, stored, and recalled within PRO 1600’s software package. It controls the reflow cycle, automation of process sequences, and automatic execution of safety checks before and during every profile run.

  • Real-Time process graphing
  • Profile processing based on part / PCB temperature control*  
  • Profile development with up to 7 thermocouples
  • Library with predefined profiles
  • On-The-Fly settings adjustment
  • Real- time data recording for documentation and analysis
  • Password Protected Access
  • User friendly environment
  • Designed for Windows® 7/8 Pro OS

 

Options / Accessories

  • External Thermocouple Control (Part: ETC-PRO)
    • profile is executed based on temperature reading from the product
    • interchangeable between fixed and external thermocouple controls
  • Double Sided PCB Fixture (Part: DSBF-PRO)
  • Laptop Computer Stand (Part: LCS-PRO)
  • 400 VAC 3 Phase Electrical Configuration
  • Custom Fixtures / Trays and Cable Feed-Throughs
  • Video Recording and Observation Module (Part: VRM-PRO)

 

Specifications

PRO 1600-RS
Temperature: up to 375° Celsius
Reflow Area: 20" x 20" / 508mm x 508mm
Topside Clearance: 4" / 101mm
Programmable Heating Zones: 10
Cooling Zones: 2
Heating Type: Full Forced Air / Nitrogen Convection
Interior: Stainless Steel
Air Requirements: 80 - 120 PSI @ 0.3 CFM
Power Requirements: 120/208 VAC, 3 Phase, 50 Amp, 50/60 Hz
Optional 125/250 VAC, 1 Phase, 50 Amp, 50/60 Hz
Optional 200-240 VAC, 3 Phase, 50 Amp, 50/60 Hz
Optional 380-400 VAC, 3 Phase, 50 Amp, 50/60 Hz
Peak Power Consumption: 16 Kw (during ramp up stages of a profile)
Operating Consumption: 9 Kw (during reflow)
Warranty: Five (5) years parts and labor
Agency Approvals: CE
Weight: 185 lbs / 84 Kg
Dimensions: 31"L x 31"W x 50"H / 787mm x 787mm x 1270mm









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