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AT-707 Series BGA Rework Stations

Product Overview

The AT-707 series BGA Rework Stations are semiautomatic machines featuring spilt vision optics and precise software process control. Systems are used to rework various devices such as BGA’s, CSP’s, QFN’s, QFP’s, and other complex SMD’s in both Lead-Free and Eutectic applications. High level of automation limits operator involvement making these machines very easy to use. As well as, provides high quality results that are consistent from one board to the next.

Split vision optics allows simultaneous top of the PCB / bottom of the component viewing to superimpose and align images (using X, Y and Theta micrometer adjustments). A Split Imaging Device creates diagonal corner viewing for alignment of larger packages at high magnification. It is also critical in viewing the walls of the nozzle in relation to the PCB to ensure that adjacent components will not be interrupted during reflow. Adjustable placement pressure ensures complete control in rework of various package types. Closed loop reflow process control enables mimicking the original production profile. The comprehensive software package easily allows modifying and optimizing reflow profiles with an on-the-fly settings adjustment capability. It also controls airflow, top and bottom forced convection heaters, and automation of process sequences. Precisely controlled cooling via compressed air / nitrogen plays a critical role in achieving high quality joint.

Unique machine design based on a truly semi-automatic platform enables repeatable process control and accuracy. AT-707 series offer unparalleled performance, ease of use, and an exceptional value making them superior systems heads above the competition.

References


Key Features

  • Single Axis Placement and Reflow
  • Split Vision Optics with LED lighting
  • Forced Air / Nitrogen Convection top and bottom heaters
  • Adjustable placement force
  • Computer control with comprehensive software package
  • Closed Loop process control
  • Automated Z axis movement
  • Precision board holder with vacuum locking base, X-Y micrometers, underside support
  • Compressed air cooling bypassing the heater yields strong, quality joints
  • Four thermocouple inputs
  • Library of predefined profiles
  • Software controlled process sequencing with safety interlocks
  • Plug and Operate Configuration
  • Minimal operator involvement
  • Maintenance Free
  • Lead Free Compatible
  • Designed and Manufactured in USA

Operation

At the click of an icon, the system automatically places the component onto a PCB, shuts off the vacuum to the pick- up tube, lifts the pick-up nozzle away from the package body, executes a reflow profile, and raises the reflow head at the completion of a cycle. Removal features the same automation only now, the component is pulled off the board at the completion of reflow.

Software

Profiles are developed, stored, and recalled in the AT-707’s software package. It controls the reflow cycle, automation of process sequences, and automatic execution of safety checks before every profile run.

  • Real-Time process graphing
  • Profile development with up to 4 thermocouples
  • Library with predefined profiles
  • On-The-Fly settings adjustment
  • Real - time data recording fordocumentation and analysis
  • Password Protected Access
  • Unlimited profile storage
  • User friendly environment
  • Designed for Windows® XP / Vista OS

Features Comparison

There are two configurations of the AT-707 series. Both share the same platform and principle of operation. Below is a comparison matrix indicating features of each model

 AT-707AT-707FL
Split Vision Optics
X
X
LED Lighting system with intensity control
X
X
Single axis placement and reflow
X
X
Z Axis Movement - automatic
X
X
Precision X-Y Micrometer Adjustments
X
X
Theta Rotational Adjustment
X
X
Board holder with vacuum locking base 
X
X
Macro adjustment of board holder
X
X
Adjustable placement force
X
X
Automated component place and nozzle lift up
X
X
Compressed air cooling
X
X
Component Positioning Nest
X
X
Control Software Package
X
X
Four Thermocouple Inputs
X
X
Notebook PC with Vista OS
X
X
20"LCD Monitor with mounting arm
N/A
X
Heavy Duty Stand with PC mounting 
N/A
X
Nozzle - 2 of any size
X
X
Split Imaging Device
O
X
Nozzle - Individual
O
O
Nozzle Kit
O
O
Flux Transfer Plates Kit
O
O
Positioning Plate
O
O
Stencil for solder paste application
O
O
BGA / CSP Reballing Kit
O
O
X - Included; O - Optional; N/A - Not Available

 

Options / Accessories

  • Nozzle (Part: NZ-AT707)
  • Nozzle Kit (Part: NZK-AT707)
  • Split Imaging Device (Part: SID-AT707)
  • Positioning Plate (Part: PP-AT707)
  • Flux Transfer Plate Kit (Part: FTP-AT707)
  • Paste Transfer Stencil (Part: STN-AT707)
  • BGA / CSP Reballing Kit (Part: BRK-AT707)

Specifications

 AT-707AT-707FL
Board Handling Up to 14" x 20" (350mm x 508mm) Up to 20" x 20" (508mm x 508mm)
Component Handling    
Maximum 1.58” x 1.58” (40mmSQ): 57mm Optional 2.25” x 2.25” (57mmSQ)  
Minimum 0.04” x 0.04” (1mmSQ) 0.04” x 0.04” (1mmSQ)
Typical Components Reworked BGAs, uBGAs, CSPs, CBGAs, QFNs, LCCs, MLFs, QFPs, TSOPs, PLCCs, SOICs, Flip chips, micro SMD's BGAs, uBGAs, CSPs, CBGAs, QFNs, LCCs, MLFs, QFPs, TSOPs, PLCCs, SOICs, Flip chips, micro SMD's
PCB Thickness Up to 0.32” (8mm) Up to 0.32” (8mm)
Placement Accuracy +/- 0.0004" (+/- 10 microns) +/- 0.0004" (+/- 10 microns)
Top Heater (Forced Air/N2 Conv.) 800 Watts 800 Watts
Preheater (Forced Air Conv.) 2500 Watts  2500 Watts
Magnification Up to 60X Up to 60X
Temperature / Time / Airflow Closed-Loop Software Control  Closed-Loop Software Control 
Power 120 VAC, 25A, 50/60 Hz | 220/240 VAC, 15A, 50/60 Hz 120 VAC, 25A, 50/60 Hz| 220/240 VAC, 15A, 50/60 Hz 
Air / Gas 90-120  PSI @ 2.5 CFM   90-120  PSI @ 2.5 CFM  
Facility Placement Bench top Stand Alone Floor Unit
Weight 200 lbs / 91 Kg  270 lbs / 122 Kg
Dimensions 31"L x 25"W x 34"H (787mm x 635mm x 864mm) 38"L x 34"W x 50"H (965mm x 864mm x 1270mm)
Warranty Five (5) years parts and labor Five (5) years parts and labor















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