Products

 

Bookmark and Share

AT-GDP SMD / BGA Placement & Rework Stations

Product Overview

The AT-GDP Series SMD / BGA Rework Stations feature the latest vision and thermal process control technologies. Printed circuit boards and substrates consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, PoP, Wafer Level Dies, and many other SMD’s are processed with consistently high quality results. Precise mechanics and advanced software simplifies component placement, soldering, and/or rework. Operator involvement is very limited making these systems easy to setup and use. Available in benchtop and standalone configurations, these machines are ideal for prototype R&D, NPI, Engineering, Failure Analysis labs as well as OEM / CEM production environments. Automation, machines' capability, and ease of use are critical for both prototype and production volume applications requiring consistency and quality.

Solid design enables ultra precise placement to within 0.0002" or 5 microns. A newly implemented software driven Force Measurement System makes it possible to handle even the smallest and fragile devices along with complex packages like stacked dies or Package-On-Package (PoP). Split Vision Optics allows simultaneous top of the PCB / substrate and bottom of the component viewing to superimpose and align both images. Split Imaging is a feature that creates diagonal corner viewing for alignment of larger packages at high magnification. High quality components within the optics system ensure a clear and distortion free imaging. Precise closed loop reflow process control enables mimicking the original production profile. Software contains a database of predefined profiles which the user selects based on the package and PCB being reworked. An Automated Profile Generation feature allows the user to develop an optimum profile in a single pass that may be saved for future processing. Profiles may be easily modified, optimized, and stored for future use. Settings can be adjusted on-the-fly while the profile is running. Software controls reflow via forced air / nitrogen convection top heater, forced air convection localized bottom heater, and a large area Quartz IR preheater. Airflow at the top heater is monitored by the software and delivers excellent temperature uniformity. This guarantees very gentle flow which cannot disturb even the smallest adjacent components like 01005 passives. Controlled cooling of the part and PCB is accomplished via direct air / nitrogen flow at the top nozzle, air flow at the localized bottom heater, and large area underside board cooling.

For high value / reliability assemblies such as in Aerospace, Military, and Medical applications requiring superior quality solder joints, Nitrogen gas may be purged through the top heater as a substitute for air. Numerous industry studies have shown that soldering in a Nitrogen atmosphere yields stronger, higher quality solder joints when compared to soldering using air or IR sources. This is primarily due to reduction and elimination (when reaching low levels of Oxygen) of oxidation at the bond site. It is especially the case with fine pitch devices where solder paste or flux volume at the pad site is minimal and burns off quickly at higher temperatures. Once flux burns off, good wetting cannot be achieved and results in cold, intermittent solder joint connections. If reflowed in Nitrogen, even with flux burned off, the blanket of Nitrogen gas will prevent pads and solder bumps from oxidizing. The result is good wetting and ultimately strong quality solder joints. Benefits of soldering in Nitrogen is also documented when processing multi-layer, high thermal mass assemblies especially those with solid ground planes. As the process window is extended due to longer heating times, solder pastes' flux burns off and the same poor wetting is observed in coarse pitch as with fine pitch devices. Purging Nitrogen at the top heater extends the process window and allows achieving quality solder joints even if the cycle is considerably longer due to the assemblies heavy thermal mass.

Like other machines that our company has been producing for over the past 25 years, AT-GDP was designed to be very easy to use and capable of handling both today’s and tomorrow’s requirements. AT-GDP series offers unparalleled performance aimed at applications where precision and consistently high quality results matter. Ranging from R & D / Engineering departments to production environments typical of volume repair centers.

Used / Demo Machine Sale                                             Financing from $390 / month References                    Limited Time Offer - Free Nozzle Kit

More Application Videos

 

Key Features

  • Single Axis Placement and Soldering Design
  • Split Vision Optics with LED lighting
  • Precision Placement within +/- 0.0002" or 5 microns
  • Standard configuration handles devices down to 0.03"Sq or 0.75mmSq (down to 0.4mm x 0.25mm available)
  • Air / Nitrogen Top heater and Area Quartz IR / Focused Local Air Preheaters
  • Nitrogen soldering and cooling ready
  • Force Measurement System with software control
  • Computer control with comprehensive software package
  • Closed Loop process control
  • In Process Jogging of the Reflow Head
  • Automated Z axis with 2 stage programmable speed
  • Precision board holder with vacuum locking base, X-Y micrometers, underside support
  • Compressed air cooling bypassing the heater yields strong, quality joints
  • Five thermocouple inputs
  • Library of predefined profiles
  • Software controlled process sequencing with safety interlocks
  • Plug and Operate Configuration
  • Minimal operator involvement
  • Maintenance Free
  • Designed and Manufactured in USA

 

Operation

At the click of an icon, the system automatically places the component onto the PCB, shuts off the vacuum to the pick up tube, lifts the pick up nozzle away from the package body, executes a soldering profile, and raises the reflow head at the completion of a cycle. Removal features the same automation only now, the component is pulled off the board at the completion of a cycle.

More Application Videos

 

Software

Profiles are developed, stored, and recalled in the AT-GDP’s software package. It controls the reflow soldering cycle, automation of process sequences, and automatic execution of safety checks before every profile run.

  • Real-Time process graphing
  • Automatic Profile Generation
  • Profile development with up to 5 external thermocouples
  • Library with predefined profiles
  • On-The-Fly settings adjustment
  • Real - time data recording for documentation and analysis
  • Password Protected Access
  • Unlimited profile storage
  • User friendly environment
  • Designed for Windows® 7 Pro / 10 Pro OS

 

Features Comparison

There are three configurations of the AT-GDP series. All of which share the same rigid platform and principle of operation. Below is a comparison matrix indicating features of each model.

 AT-GDP-1AT-GDP-2AT-GDP-3
Split Vision Optics
X
X
X
LED Lighting system with intensity control
X
X
X
Single axis placement and soldering
X
X
X
Z Axis Movement - automatic
X
X
X
Precision X-Y Micrometer Positioning Stage
X
X
X
Theta Micrometer Adjustment
X
X
X
Board / substrate holder with vacuum locking base 
X
X
X
Macro adjustment of board holder
X
X
X
Placement Force Control and Measurement System
X
X
X
Automated component place and nozzle lift up
X
X
X
Compressed air / nitrogen cooling
X
X
X
Control Software Package
X
X
X
Five Thermocouple Inputs
X
X
X
Notebook PC with 7 / 10 Pro OS
X
X
X
22"LED Monitor with mounting arm
N/A
X
X
Heavy Duty Stand with PC mounting 
N/A
N/A
X
Nozzle - 2 of any size
X
X
X
Split Imaging Alignment 
O
O
X
Nozzle Kit
O
O
O
Flux Transfer Plates Kit
O
O
O
Stencil for solder paste application
O
O
O
BGA Reballing Kit
O
O
O
01005 / 0201 Passives Handling
O
O
O
Process monitoring camera
O
O
O
X - Included   O - Optional   N/A - Not Available

 

Options / Accessories

  • Split Imaging Alignment (Part: SIA-ATGDP)
  • Flux / Solder Paste Transfer Plate Kit (Part: FTP-ATGDP)
  • Solder Paste Transfer Stencil (Part: STN-ATGDP)
  • BGA Reballing Kit (Part: BRK-ATGDP)
  • Nozzle Kit - 10 pcs. (Part: NZK-ATGDP)
  • 01005 / 0201 Passives Handling (Part: 01005/0201-ATGDP)
  • Process Monitoring Camera (Part: PMC-ATGDP)
  • Composite fixture for micro substrates / small PCB modules

 

Specifications

 AT-GDP-1AT-GDP-2AT-GDP-3
Board Handling Up to 12" x 14" (305mm x 355mm) Up to 16" x 20" (406mm x 508mm) Up to 16" x 20" (406mm x 508mm)
Component Handling      
Maximum 1.58” x 1.58” (40mmSQ) Optional 2.25” x 2.25” (57mmSQ) 1.58” x 1.58” (40mmSQ) Optional 2.25” x 2.25” (57mmSQ) 2.25” x 2.25” (57mmSQ)  
Minimum 0.016” x 0.008” (0.4mm x 0.2mm) w/t 01005 option 0.016” x 0.008” (0.4mm x 0.2mm) w/t 01005 option 0.016” x 0.008” (0.4mm x 0.2mm) w/t 01005 option
Typical Components Reworked BGAs, FPGA, uBGAs, CSPs, PoP, CBGAs, QFNs, LGAs, LCCs, MLFs, QFPs, TSOPs, SOICs, Flip chips, WL-CSPs, micro SMD's, RFID Dies, micro passives BGAs, FPGA, uBGAs, CSPs, PoP, CBGAs, QFNs, LGAs, LCCs, MLFs, QFPs, TSOPs, SOICs, Flip chips, WL-CSPs, micro SMD's, RFID Dies, micro passives BGAs, FPGA, uBGAs, CSPs, PoP, CBGAs, QFNs, LGAs, LCCs, MLFs, QFPs, TSOPs, SOICs, Flip chips, WL-CSPs, micro SMD's, RFID Dies, micro passives
PCB Thickness Up to 0.32” (8mm) Up to 0.32” (8mm) Up to 0.32” (8mm)
Placement Accuracy +/- 0.0002"    (+/- 5 microns) +/- 0.0002"    (+/- 5 microns) +/- 0.00004"    (+/- 1 microns)
Top Heater (Air/N2 Conv.) 1000 Watts 1000 Watts 1000 Watts
Preheater (Quartz IR) 2000 Watts(8" x 12" or 203mm x 305mm) 2400 Watts(12" x 12" or 305mm x 305mm) 2400 Watts(12" x 12" or 305mm x 305mm)
Preheater (Local Air Conv.) 500 Watts(2" OD) 500 Watts(2" OD) 500 Watts(2" OD)
Magnification Up to 420X Up to 420X Up to 420X
Temperature / Time / Airflow Closed-Loop Software Control  Closed-Loop Software Control  Closed-Loop Software Control 
Power 120 VAC 30A or 208-240 VAC 20A,1 Phase, 50/60 Hz 120 VAC 30A or 208-240 VAC 20A,1 Phase, 50/60 Hz 120 VAC 30A or 208-240 VAC 20A,1 Phase, 50/60 Hz
Air / Gas 95-120  PSI @ 4 CFM   95-120  PSI @ 4 CFM   95-120  PSI @ 4 CFM  
Facility Placement Heavy Duty Bench (500lbs. minimum weight capacity) Heavy Duty Bench (500lbs. minimum weight capacity) Stand Alone Floor Unit
Weight 224 lbs / 101 Kg  240 lbs / 110 Kg 280 lbs / 127 Kg 
Dimensions 36"L x 18"W x 44"H (915mm x 457mm x 1118mm) 48"L x 18"W x 44"H (1220mm x 457mm x 1118mm) 48"L x 28"W x 78"H (1220mm x 711mm x 1981mm)
Warranty Five (5) years parts and labor Five (5) years parts and labor Five (5) years parts and labor















  Copyright 2009 - 2015. Advanced Techniques US, Inc.