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AT-GDP Series BGA / SMT Rework Stations

Product Overview

The AT-GDP Series BGA / SMT Rework Stations feature the latest vision and thermal process control technologies. Circuit boards consisting of complex components such as BGA’s, CSP’s, QFN’s, Flip Chips, PoP, micro Dies, and many other SMD’s are processed delivering high quality results. Precise mechanics along with an advanced software package automates the device removal and installation. Machine automation limits operator involvement making these systems very easy to use. Automation and ease of use are both critical for prototype and low volume applications where success must be achieved on the first try.

Solid design enables ultra precise placement to within 5 microns. A newly implemented software driven Force Measurement System makes it possible to handle even the smallest and fragile devices along with complex packages like stacked dies or Package-On-Package (PoP). Split Vision Optics allows simultaneous top of the PCB / substrate and bottom of the component viewing to superimpose and align both images. Split Imaging is a feature that creates diagonal corner viewing for alignment of larger packages at high magnification. High quality components within the optics system ensure a clear and distortion free imaging. Precise closed loop reflow process control enables mimicking the original production profile. Software contains a database of predefined profiles which the user selects based on the package and PCB being reworked. An Automated Profile Generation feature allows the user to develop an optimum profile in a single pass that may be saved for future processing. Profiles may be easily modified, optimized, and stored for future use. Settings can be adjusted on-the-fly while the profile is running. Software controls reflow via forced air / nitrogen convection top heater, forced air convection localized bottom heater, and a large area Quartz IR preheater. Airflow at the top heater is monitored by the software as well and delivers unsurpassed temperature uniformity. This guarantees very gentle flow which cannot disturb even the smallest adjacent components. Controlled cooling of the part and PCB is accomplished via direct air / nitrogen flow at the top nozzle, air flow at the localized bottom heater, and large area underside board cooling.

Like other machines that our company has been producing for over the past 25 years, AT-GDP was designed to be very easy to use and capable of handling both today’s and tomorrow’s requirements. AT-GDP series offers unparalleled performance aimed at applications where precision and consistently high quality results matter. Ranging from R & D / Engineering departments to production environments typical of volume repair centers.

Schedule a Demonstration               Financing / Leasing Available    

References                                           Special Offer - Free Nozzle Kit    

 

Key Features

  • Single Axis Placement and Reflow
  • Split Vision Optics with LED lighting
  • Forced Air / N2 Convection Top heater and Area Quartz IR / Focused Local Air Preheaters
  • New Force Measurement System with software control
  • Computer control with comprehensive software package
  • Closed Loop process control
  • Automated Z axis with 2 stage programmable speed
  • Precision board holder with vacuum locking base, X-Y micrometers, underside support
  • Compressed air cooling bypassing the heater yields strong, quality joints
  • Five thermocouple inputs
  • Library of predefined profiles
  • Software controlled process sequencing with safety interlocks
  • Plug and Operate Configuration
  • Minimal operator involvement
  • Maintenance Free
  • Lead Free Compatible
  • Designed and Manufactured in USA

 

Operation

At the click of an icon, the system automatically places the component onto the PCB, shuts off the vacuum to the pick up tube, lifts the pick up nozzle away from the package body, executes a reflow profile, and raises the reflow head at the completion of a cycle. Removal features the same automation only now, the component is pulled off the board at the completion of a cycle.

More Application Videos

 

Software

Profiles are developed, stored, and recalled in the AT-GDP’s software package. It controls the reflow cycle, automation of process sequences, and automatic execution of safety checks before every profile run.

  • Real-Time process graphing
  • Automatic Profile Generation
  • Profile development with up to 5 thermocouples
  • Library with predefined profiles
  • On-The-Fly settings adjustment
  • Real - time data recording for documentation and analysis
  • Password Protected Access
  • Unlimited profile storage
  • User friendly environment
  • Designed for Windows® XP / Vista / 7 Pro / 8 Pro OS

 

Features Comparison

There are three configurations of the AT-GDP series. All of which share the same rigid platform and principle of operation. Below is a comparison matrix indicating features of each model.

 AT-GDP-1AT-GDP-2AT-GDP-3
Split Vision Optics
X
X
X
LED Lighting system with intensity control
X
X
X
Single axis placement and reflow
X
X
X
Z Axis Movement - automatic
X
X
X
Precision X-Y Micrometer Adjustments
X
X
X
Theta Rotational Adjustment
X
X
X
Board holder with vacuum locking base 
X
X
X
Macro adjustment of board holder
X
X
X
Force Measurement System
X
X
X
Automated component place and nozzle lift up
X
X
X
Compressed air cooling
X
X
X
Component Positioning Nest
X
X
X
Control Software Package
X
X
X
Five Thermocouple Inputs
X
X
X
Notebook PC with 7 Pro OS
X
X
X
20"LCD Monitor with mounting arm
N/A
X
X
Heavy Duty Stand with PC mounting 
N/A
N/A
X
Nozzle - 2 of any size
X
X
X
Split Imaging Alignment 
O
O
X
Nozzle - Individual
O
O
O
Nozzle Kit
O
O
O
Flux Transfer Plates Kit
O
O
O
Positioning Plate
O
O
O
Stencil for solder paste application
O
O
O
BGA / CSP Reballing Kit
O
O
O
01005 / 0201 Passives Handling
O
O
O
Process monitoring camera
O
O
O
X - Included   O - Optional   N/A - Not Available

 

Options / Accessories

  • Split Imaging Alignment (Part: SIA-ATGDP)
  • Flux / Solder Paste Transfer Plate Kit (Part: FTP-ATGDP)
  • Solder Paste Transfer Stencil (Part: STN-ATGDP)
  • BGA / CSP Reballing Kit (Part: BRK-ATGDP)
  • Nozzle (Part: NZ-ATGDP)
  • Nozzle Kit - 10 pcs. (Part: NZK-ATGDP)
  • 01005 / 0201 Passives Handling (Part: 01005/0201-ATGDP)
  • Process Monitoring Camera (Part: PMC-ATGDP)

 

Specifications

 AT-GDP-1AT-GDP-2AT-GDP-3
Board Handling Up to 12" x 14" (305mm x 355mm) Up to 16" x 20" (406mm x 508mm) Up to 16" x 20" (406mm x 508mm)
Component Handling      
Maximum 1.58” x 1.58” (40mmSQ) Optional 2.25” x 2.25” (57mmSQ) 1.58” x 1.58” (40mmSQ) Optional 2.25” x 2.25” (57mmSQ) 2.25” x 2.25” (57mmSQ)  
Minimum 0.016” x 0.008” (0.4mm x 0.2mm) w/t 01005 option 0.016” x 0.008” (0.4mm x 0.2mm) w/t 01005 option 0.016” x 0.008” (0.4mm x 0.2mm) w/t 01005 option
Typical Components Reworked BGAs, FPGA, uBGAs, CSPs, PoP, CBGAs, QFNs, LGAs, LCCs, MLFs, QFPs, TSOPs, SOICs, Flip chips, WLCSPs, micro SMD's, RFID Dies, micro passives BGAs, FPGA, uBGAs, CSPs, PoP, CBGAs, QFNs, LGAs, LCCs, MLFs, QFPs, TSOPs, SOICs, Flip chips, WLCSPs, micro SMD's, RFID Dies, micro passives BGAs, FPGA, uBGAs, CSPs, PoP, CBGAs, QFNs, LGAs, LCCs, MLFs, QFPs, TSOPs, SOICs, Flip chips, WLCSPs, micro SMD's, RFID Dies, micro passives
PCB Thickness Up to 0.32” (8mm) Up to 0.32” (8mm) Up to 0.32” (8mm)
Placement Accuracy +/- 0.0002"    (+/- 5 microns) +/- 0.0002"    (+/- 5 microns) +/- 0.00004"    (+/- 1 microns)
Top Heater (Forced Air/N2 Conv.) 1000 Watts 1000 Watts 1000 Watts
Preheater (Quartz IR) 1600 Watts(8" x 12" or 203mm x 305mm) 2400 Watts(12" x 12" or 305mm x 305mm) 2400 Watts(12" x 12" or 305mm x 305mm)
Preheater (Local Air Conv.) 300 Watts(2" OD) 300 Watts(2" OD) 300 Watts(2" OD)
Magnification Up to 60X Up to 60X Up to 60X
Temperature / Time / Airflow Closed-Loop Software Control  Closed-Loop Software Control  Closed-Loop Software Control 
Power 120 VAC 25A or 208-240 VAC 15A,1 Phase, 50/60 Hz 120 VAC 30A or 208-240 VAC 20A,1 Phase, 50/60 Hz 120 VAC 30A or 208-240 VAC 20A,1 Phase, 50/60 Hz
Air / Gas 90-115  PSI @ 3.5 CFM   90-115  PSI @ 3.5 CFM   90-115  PSI @ 3.5 CFM  
Facility Placement Heavy Duty Bench (500lbs. minimum weight capacity) Heavy Duty Bench (500lbs. minimum weight capacity) Stand Alone Floor Unit
Weight 220 lbs / 100 Kg  240 lbs / 110 Kg 280 lbs / 127 Kg 
Dimensions 36"L x 18"W x 44"H (915mm x 457mm x 1118mm) 48"L x 18"W x 44"H (1220mm x 457mm x 1118mm) 48"L x 28"W x 78"H (1220mm x 711mm x 1981mm)
Warranty Five (5) years parts and labor Five (5) years parts and labor Five (5) years parts and labor




















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