Products

AT-GDP Series BGA / QFN / SMT Placement & Rework Stations
AT-707 Series BGA Placement & Rework Stations
PRO 1600 Forced Convection SMT Reflow Oven
CAT90-SA Series Pick and Place Systems
CAT90-M Pick and Place System
PRO 1600-B Benchtop Convection Reflow Oven

Wafer Level Chip Scale Package (WLCSP) Removal and Installation

Demonstration of a Wafer Level Chip Scale Package (WLCSP) being removed and installed on a printed circuit board using an AT-GDP Placement and Rework Station. WLCSP measures 1.5mm x 1.5mm with a 0.4mm pitch.