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ApplicationsBGA Removal and Installation
Unlike surface mount components with leads around the perimeter (i.e. QFP), Ball Grid Array (BGA) packages contain a matrix of solder spheres on the bottom side. From a design standpoint, one of the benefits that a BGA offers versus a QFP is having greater number of I/O connections over the same amount of real estate. The disadvantage however, is that those I/O connections are now hidden making rework a more complicated process requiring specialized equipment. This article details the steps of reworking a BGA device on a motherboard.
Download file CSP / µBGA Rework
Also referred to as micro BGA’s, Chip Scale Packages (CSP) although similar to traditional BGA components differ in overall size and diameter of solder spheres. Their size is typically smaller and solder spheres are about ½ the diameter of BGA’s which range from 0.55mm to 0.75mm. This article details rework of a CSP on a test board using an AT-GDP Rework Station. A Lead Free profile has been applied during removal and installation processes.
Download file Flip Chip Installation
An increase in implementation of Flip Chips, Dies, and other micro SMD devices with hidden joints within
PCB and IC assembly sectors requires capability to precisely install and rework such devices. This article
details the installation process of a Flip Chip onto a BGA IC substrate using an AT-GDP Rework Station.
A Eutectic Soldering process is being applied.
Download file BGA ReworkMicro BGA / CSP ReworkWafer Level Chip Scale Package (WLCSP) Removal and InstallationQFN / MLF ReworkFine Pitch Connector ReworkFine Pitch QFP 208 Rework |
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