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BGA / SMT Rework


Wafer Level Chip Scale Package (WLCSP) Removal and Installation


4-Ball BGA 0.8mm x 0.8mm - Placement and Soldering

Rework of a 4 - ball Wafer Level Chip Scale Package (WLCSP) measuring 0.8mm x 0.8mm from a 7mm x 6mm PCB. The 4 solder balls that are 0.26mm in diameter with 0.4mm pitch. The removal / installation process was performed using the AT-GDP Placement & Rework Station.

QFN / MLF Rework


Micro BGA / CSP Rework


Reflow Soldering with Video Recording and Observation module


Fine Pitch Connector Rework


Fine Pitch QFP 208 Rework


CSP / BGA Rework

Also referred to as micro BGAs, Chip Scale Packages (CSP) although similar to traditional BGA components differ in overall size and diameter of solder spheres. Their size is typically smaller and solder spheres are about ½ the diameter of BGAs which range from 0.55mm to 0.75mm. This article details rework of a CSP on a test board using an AT-GDP Rework Station. A Lead Free profile has been applied during removal and installation processes.
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BGA Removal and Installation

Unlike surface mount components with leads around the perimeter (i.e. QFP), Ball Grid Array (BGA) packages contain a matrix of solder spheres on the bottom side.  From a design standpoint, one of the benefits that a BGA offers versus a QFP is having greater number of I/O connections over the same amount of real estate.  The disadvantage however, is that those I/O connections are now hidden making rework a more complicated process requiring specialized equipment.  This article details the steps of reworking a BGA device on a motherboard.
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